CDP1802A, CDP1802AC, CDP1802BC CMOS 8-Bit Microprocessors Features Description • Maximum Input Clock Maximum Frequency Options
The CDP1802 family of CMOS microprocessors are 8-bit
At VDD = 5V
register oriented central processing units (CPUs) designed
- CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . 3.2MHz
for use as general purpose computing or control elements in
- CDP1802BC. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0MHz
a wide range of stored program systems or products. • Maximum Input Clock Maximum Frequency Options
The CDP1802 types include all of the circuits required for
At VDD = 10V
fetching, interpreting, and executing instructions which have
- CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . 6.4MHz
been stored in standard types of memories. Extensive
• Minimum Instruction Fetch
input/output (I/O) control features are also provided to facili-
-Execute Times - CDP1802A, AC . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0µs
The 1800 series architecture is designed with emphasis on
- CDP1802BC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2µs
the total microcomputer system as an integral entity so thatsystems having maximum flexibility and minimum cost can
• Any Combination of Standard RAM and ROM Up to
be realized. The 1800 series CPU also provides a synchro-
65,536 Bytes
nous interface to memories and external controllers for I/O
• 8-Bit Parallel Organization With Bidirectional Data Bus
devices, and minimizes the cost of interface controllers. Fur-
and Multiplexed Address Bus
ther, the I/O interface is capable of supporting devices oper-ating in polled, interrupt driven, or direct memory access
• 16 x 16 Matrix of Registers for Use as Multiple Program Counters, Data Pointers, or Data Registers
The CDP1802A and CDP1802AC have a maximum input
• On-Chip DMA, Interrupt, and Flag Inputs
clock frequency of 3.2MHz at VDD = 5V. The CDP1802A and
• Programmable Single
CDP1802AC are functionally identical. They differ in that the
-Bit Output Port
CDP1802A has a recommended operating voltage range of
• 91 Easy-to-Use Instructions
4V to 10.5V, and the CDP1802AC a recommended operat-
The CDP1802BC is a higher speed version of the
CDP1802AC, having a maximum input clock frequency of
5.0MHz at VDD = 5V, and a recommended operating voltage
Ordering Information PART NUMBER 5V - 3.2MHz TEMPERATURE RANGE
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright Intersil Corporation 19993-3
CDP1802A, CDP1802AC, CDP1802BC 40 LEAD PDIP (PACKAGE SUFFIX E) 44 LEAD PLCC 40 LEAD SBDIP (PACKAGE SUFFIX D) (PACKAGE TYPE Q) INTERRUPT 1 44 43 42 41 40 18 19 20 21 22 23 24 25 26 27 28 ADDRESS BUS INPUT PORT CS2 8-BIT CPU 32 BYTE RAM FIGURE 1. TYPICAL CDP1802 SMALL MICROPROCESSOR SYSTEM CDP1802A, CDP1802AC, CDP1802BC Block Diagram I/O REQUESTS MEMORY ADDRESS LINES I/O FLAGS MA6 MA4 MA2 MA0 EF1 MA7 MA5 MA3 MA1 CONTROL AND TIMING LOGIC TO INSTRUCTION REGISTER R(0).1 R(0).0 R(1).1 R(1).0 R R(2).1 R(2).0 R(9).1 R(9).0 R(A).1 R(A).0 COMMANDS R(E).1 R(E).0 R(F).1 R(F).0 8-BIT BIDIRECTIONAL DATA BUS FIGURE 2. CDP1802A, CDP1802AC, CDP1802BC Absolute Maximum Ratings Thermal Information
(All Voltages Referenced to VSS Terminal)
PDIP . . . . . . . . . . . . . . . . . . . . . . . . . .
CDP1802A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +11V
PLCC . . . . . . . . . . . . . . . . . . . . . . . . . .
CDP1802AC, CDP1802BC . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
SBDIP . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage Range, All Inputs . . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, any One Input . . . . . . . . . . . . . . . . . . . . . . . . .±10mA
TA = Full Package Temperature Range . . . . . . . . . . . . . . . 100mW
Package Type D . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oCPackage Type E and Q . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC
Storage Temperature Range (TSTG) . . . . . . . . . . . . -65oC to +150oCLead Temperature (During Soldering)
At distance 1/16 ±1/32 In. (1.59 ± 0.79mm)from case for 10s max . . . . . . . . . . . . . . . . . . . . . . . . . . . +265oCLead Tips Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationof the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Recommended Operating Conditions TA = -40oC to +85oC. For maximum reliability, operating conditions should be selected so
that operation is always within the following ranges:
TEST CONDITIONS CDP1802A CDP1802AC CDP1802BC PARAMETER
1. Printed circuit board mount: 57mm x 57mm minimum area x 1.6mm thick G10 epoxy glass, or equivalent.
2. VCC must never exceed VDD. 3. Equals 2 machine cycles - one Fetch and one Execute operation for all instructions except Long Branch and Long Skip, which require 3
machine cycles - one Fetch and two Execute operations.
4. θJA is measured with component mounted on an evaluation board in free air. CDP1802A, CDP1802AC, CDP1802BC Static Electrical Specifications at TA = -40oC to +85oC, Except as Noted CDP1802AC, TEST CONDITIONS CDP1802A CDP1802BC PARAMETER CDP1802A, CDP1802AC, CDP1802BC Static Electrical Specifications at TA = -40oC to +85oC, Except as Noted (Continued) CDP1802AC, TEST CONDITIONS CDP1802A CDP1802BC PARAMETER
1. Typical values are for TA = +25oC and nominal VDD. 2. Idle “00” at M(0000), CL = 50pF. Dynamic Electrical Specifications T CDP1802A, CONDITIONS CDP1802AC CDP1802BC PARAMETER PROPAGATION DELAY TIMES CDP1802A, CDP1802AC, CDP1802BC Dynamic Electrical Specifications T
5%, Except as Noted (Continued) CDP1802A, CONDITIONS CDP1802AC CDP1802BC PARAMETER MINIMUM SET UP AND HOLD TIMES CDP1802A, CDP1802AC, CDP1802BC Dynamic Electrical Specifications T
5%, Except as Noted (Continued) CDP1802A, CONDITIONS CDP1802AC CDP1802BC PARAMETER
1. Typical values are for TA = +25oC and nominal VDD. 2. Maximum limits of minimum characteristics are the values above which all devices function. Timing Specifications as a function of T(T = 1/fCLOCK) at TA = -40 to +85oC, Except as Noted CDP1802A, TEST CONDITIONS CDP1802AC CDP1802BC PARAMETERS CDP1802A, CDP1802AC, CDP1802BC Timing Specifications as a function of T(T = 1/fCLOCK) at TA = -40 to +85oC, Except as Noted CDP1802A, TEST CONDITIONS CDP1802AC CDP1802BC PARAMETERS
1. Typical values are for TA = +25oC and nominal VDD. Timing Waveforms FETCH (READ) EXECUTE (WRITE) 00 01 10 11 20 21 30 31 40 41 50 51 60 61 70 71 00 01 10 11 20 21 30 31 40 41 50 51 60 61 70 71 00 VALID INPUT DATA VALID OUTPUT DATA FIGURE 3. BASIC DC TIMING WAVEFORM, ONE INSTRUCTION CYCLE CDP1802A, CDP1802AC, CDP1802BC Timing Waveforms (Continued) tPLH, tPHL HIGH ORDER tPLH, tPHL LOW ORDER PLH, tPHL ADDRESS BYTE ADDRESS BYTE READ CYCLE) WRITE CYCLE) DATA FROM tPLH, tPHL CPU TO BUS tPLH, tPHL tPLH, tPHL N0, N1, N2 (I/O EXECUTION DATA LATCHED IN CPU DATA FROM BUS TO CPU DMA SAMPLED (S1, S2, S3) INTERRUPT SAMPLED (S1, S2) INTERRUPT FLAG LINES SAMPLED (IN S1) ANY NEGATIVE TRANSITION
1. This timing diagram is used to show signal relationships only and does not represent any specific machine cycle. 2. All measurements are referenced to 50% point of the waveforms. 3. Shaded areas indicate “Don’t Care” or undefined state. Multiple transitions may occur during this period. FIGURE 4. TIMING WAVEFORM CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms (Propagation Delays Not Shown) CYCLE (n + 1) CYCLE (n + 2) LOW ADDRESS LOW ADDRESS LOW ADDRESS FIGURE 5. GENERAL TIMING WAVEFORMS INSTRUCTION FETCH (S0) EXECUTE (S1) FETCH (S0) MEMORY READ CYCLE NON MEMORY CYCLE MEMORY READ CYCLE MWR (HIGH) VALID OUTPUT ALLOWABLE MEMORY ACCESS “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE FIGURE 6. NON-MEMORY CYCLE TIMING WAVEFORMS INSTRUCTION FETCH (S0) EXECUTE (S1) FETCH (S0) MEMORY READ CYCLE MEMORY WRITE CYCLE MEMORY READ CYCLE VALID OUTPUT ALLOWABLE MEMORY ACCESS CPU OUTPUT VALID DATA TO MEMORY “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE FIGURE 7. MEMORY WRITE CYCLE TIMING WAVEFORMS CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms (Propagation Delays Not Shown) (Continued) INSTRUCTION FETCH (S0) EXECUTE (S1) FETCH (S0) MEMORY READ CYCLE MEMORY READ CYCLE MEMORY READ CYCLE MWR (HIGH) ALLOWABLE MEMORY ACCESS VALID OUTPUT “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE FIGURE 8. MEMORY READ CYCLE TIMING WAVEFORMS INSTRUCTION FETCH (S0) EXECUTE (S1) EXECUTE (S1) FETCH (S0) MEMORY READ CYCLE MEMORY READ CYCLE MEMORY READ CYCLE MWR (HIGH) ALLOWABLE MEMORY ACCESS VALID OUTPUT VALID OUTPUT VALID OUTPUT “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE FIGURE 9. LONG BRANCH OR LONG SKIP CYCLE TIMING WAVEFORMS CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms (Propagation Delays Not Shown) (Continued) CYCLE (n + 1) INSTRUCTION FETCH (S0) EXECUTE (S1) VALID OUTPUT ALLOWABLE MEMORY ACCESS VALID DATA FROM INPUT DEVICE MEMORY READ CYCLE MEMORY WRITE CYCLE “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE USER GENERATED SIGNAL FIGURE 10. INPUT CYCLE TIMING WAVEFORMS CYCLE (n + 1) INSTRUCTION FETCH (S0) EXECUTE (S1) ALLOWABLE MEMORY ACCESS ALLOWABLE MEMORY ACCESS VALID OUTPUT VALID DATA FROM MEMORY DATA STROBE (MRD • TPB • N) MEMORY READ CYCLE MEMORY READ CYCLE “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE USER GENERATED SIGNAL FIGURE 11. OUTPUT CYCLE TIMING WAVEFORMS CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms (Propagation Delays Not Shown) (Continued) CYCLE (n+1) CYCLE (n+2) INSTRUCTION FETCH (S0) EXECUTE (S1) VALID OUTPUT VALID DATA FROM INPUT DEVICE MEMORY READ CYCLE MEMORY READ, WRITE MEMORY WRITE CYCLE OR NON-MEMORY CYCLE “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE USER GENERATED SIGNAL FIGURE 12. DMA IN CYCLE TIMING WAVEFORMS CYCLE (n + 1) CYCLE (n + 2) INSTRUCTION FETCH (S0) EXECUTE (S1) VALID OUTPUT VALID DATA FROM MEMORY (S2 • TPB) MEMORY READ CYCLE MEMORY READ, WRITE MEMORY READ CYCLE OR NON-MEMORY CYCLE “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE USER GENERATED SIGNAL FIGURE 13. DMA OUT CYCLE TIMING WAVEFORMS CDP1802A, CDP1802AC, CDP1802BC Machine Cycle Timing Waveforms (Propagation Delays Not Shown) (Continued) CYCLE (n + 1) CYCLE (n + 2) INSTRUCTION FETCH (S0) EXECUTE (S1) INTERRUPT (S3) INTERRUPT (INTERNAL) IE VALID OUTPUT MEMORY READ, WRITE MEMORY READ CYCLE NON-MEMORY CYCLE OR NON-MEMORY CYCLE “DON’T CARE” OR INTERNAL DELAYS HIGH IMPEDANCE STATE USER GENERATED SIGNAL FIGURE 14. INTERRUPT CYCLE TIMING WAVEFORMS Performance Curves L, LOAD CAPACITANCE = 50pF L, LOAD CAPACITANCE = 50pF VCC = VDD = 10V VCC = 5V, VDD = 10V VCC = VDD = 5V UENCY (MHz) UENCY (MHz) CC = VDD = 5V , SYSTEM MAXIMUM CLOCK , SYSTEM MAXIMUM CLOCK TA, AMBIENT TEMPERATURE (oC) TA, AMBIENT TEMPERATURE (oC) FIGURE 15. CDP1802A, AC TYPICAL MAXIMUM CLOCK FIGURE 16. CDP1802BC TYPICAL MAXIMUM CLOCK FREQUENCY AS A FUNCTION OF TEMPERATURE FREQUENCY AS A FUNCTION OF TEMPERATURE CDP1802A, CDP1802AC, CDP1802BC Performance Curves (Continued) VDS, DRAIN-TO-SOURCE VOLTAGE (V) VCC = VDD = 5V VGS, GATE-TO-VOLTAGE = -5V VCC = VDD = 10V , TRANSITION TIME (ns) VCC = VDD = 5V VCC = VDD = 10V , OUTPUT HIGH (SOURCE) CURRENT (mA) TA, AMBIENT TEMPERATURE = -40oC TO +85oC L, LOAD CAPACITANCE (pF) FIGURE 17. TYPICAL TRANSITION TIME vs LOAD CAPACI- FIGURE 18. CDP1802A, AC MINIMUM OUTPUT HIGH (SOURCE) TANCE FOR ALL TYPES CURRENT CHARACTERISTICS VDS, DRAIN-TO-SOURCE VOLTAGE (V) TA = -40oC TO +85oC VGS, GATE-TO-SOURCE = 10V VGS, GATE-TO-VOLTAGE = -5V W (SINK) CURRENT (mA) , OUTPUT LO , OUTPUT HIGH (SOURCE) CURRENT (mA) DS, DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 19. CDP1802A, AC MINIMUM OUTPUT LOW (SINK) FIGURE 20. CDP1802BC MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS CURRENT CHARACTERISTICS TA = -40oC TO +85oC VCC = VDD = 5V TION DELA W (SINK) CURRENT (mA) TIME (ns) CC = VDD = 10V VGS, GATE-TO-SOURCE = 5V CC = VDD = 5V VCC = VDD = 10V , OUTPUT LO L, ∆ LOAD CAPACITANCE (pF) DS, DRAIN-TO-SOURCE VOLTAGE (V) NOTE: ANY OUTPUT EXCEPT XTAL FIGURE 21. CDP1802BC MINIMUM OUTPUT LOW (SINK) FIGURE 22. TYPICAL CHANGE IN PROPAGATION DELAY AS A CURRENT CHARACTERISTICS FUNCTION OF A CHANGE IN LOAD CAPACITANCE FOR ALL TYPES CDP1802A, CDP1802AC, CDP1802BC Performance Curves (Continued) CC = VDD = 10V WER DISSIP 10 BRANCH FOR CDP1802D (mW) , TYPICAL PO DP VCC = VDD = 5V fCL, CLOCK INPUT FREQUENCY (MHz)
NOTE: IDLE = “00” AT M(0000), BRANCH = “3707” AT M(8107), CL = 50pF
FIGURE 23. TYPICAL POWER DISSIPATION AS A FUNCTION OF CLOCK FREQUENCY FOR BRANCH INSTRUCTION AND IDLE INSTRUCTION FOR ALL TYPES Signal Descriptions Bus 0 to Bus 7 (Data Bus) Interrupt Action - X and P are stored in T after executing current instruction; designator X is set to 2; designator P is
8-bit bidirectional DATA BUS lines. These lines are used for
set to 1; interrupt enable is reset to 0 (inhibit); and instruction
transferring data between the memory, the microprocessor,
execution is resumed. The interrupt action requires one
N0 to N2 (I/O Control Lines) DMA Action - Finish executing current instruction; R(0)
Activated by an I/O instruction to signal the I/O control logic of
points to memory area for data transfer; data is loaded into
a data transfer between memory and I/O interface. These
or read out of memory; and increment R(0).
lines can be used to issue command codes or device selec-
NOTE: In the event of concurrent DMA and Interrupt requests,
tion codes to the I/O devices (independently or combined with
DMA-lN has priority followed by DMA-OUT and then Interrupt.
the memory byte on the data bus when an I/O instruction isbeing executed). The N bits are low at all times except when
SC0, SC1, (2 State Code Lines)
an I/O instruction is being executed. During this time their
These outputs indicate that the CPU is: 1) fetching an
state is the same as the corresponding bits in the N register.
instruction, or 2) executing an instruction, or 3) processing a
The direction of data flow is defined in the I/O instruction by bit
DMA request, or 4) acknowledging an interrupt request. The
N3 (internally) and is indicated by the level of the MRD signal.
levels of state code are tabulated below. All states are validat TPA. H = VCC, L = VSS.
MRD = VCC: Data from I/O to CPU and Memory
STATE CODE LINES STATE TYPE EF1 to EF4 (4 Flags)
These inputs enable the I/O controllers to transfer statusinformation to the processor. The levels can be tested by the
conditional branch instructions. They can be used in con-
junction with the INTERRUPT request line to establish inter-rupt priorities. These flags can also be used by I/O devices
to “call the attention” of the processor, in which case the pro-gram must routinely test the status of these flag(s). The
TPA, TPB (2 Timing Pulses)
flag(s) are sampled at the beginning of every S1 cycle.
Positive pulses that occur once in each machine cycle (TPB
INTERRUPT, DMA-lN, DMA-OUT (3 I/O Requests)
follows TPA). They are used by I/O controllers to interpretcodes and to time interaction with the data bus. The trailing
These inputs are sampled by the CPU during the interval
edge of TPA is used by the memory system to latch the
between the leading edge of TPB and the leading edge of
higher-order byte of the 16-bit memory address. TPA is sup-
pressed in IDLE when the CPU is in the load mode. CDP1802A, CDP1802AC, CDP1802BC MA0 to MA7 (8 Memory Address Lines) Architecture
In each cycle, the higher-order byte of a 16-bit CPU memory
The CPU block diagram is shown in Figure 2. The principal
address appears on the memory address lines MA0-7 first.
feature of this system is a register array (R) consisting of six-
Those bits required by the memory system can be strobed
teen 16-bit scratchpad registers. Individual registers in the
into external address latches by timing pulse TPA. The low
array (R) are designated (selected) by a 4-bit binary code
order byte of the 16-bit address appears on the address lines
from one of the 4-bit registers labeled N, P and X. The con-
after the termination of TPA. Latching of all 8 higher-order
tents of any register can be directed to any one of the follow-
address bits would permit a memory system of 64K bytes. MWR (Write Pulse)
1. The external memory (multiplexed, higher-order byte first,
A negative pulse appearing in a memory-write cycle, afterthe address lines have stabilized.
2. The D register (either of the two bytes can be gated to D). MRD (Read Level)
3. The increment/decrement circuit where it is increased or
decreased by one and stored back in the selected 16-bit
A low level on MRD indicates a memory read cycle. It can be
used to control three-state outputs from the addressed mem-ory which may have a common data input and output bus. If a
The three paths, depending on the nature of the instruction,
memory does not have a three-state high-impedance output,
may operate independently or in various combinations in the
MRD is useful for driving memory/bus separator gates. It is
also used to indicate the direction of data transfer during an
With two exceptions, CPU instruction consists of two 8-
I/O instruction. For additional information see Table 1.
clock-pulse machine cycles. The first cycle is the fetch cycle,and the second - and third if necessary - are execute cycles.
During the fetch cycle the four bits in the P designator select
Single bit output from the CPU which can be set or reset
one of the 16 registers R(P) as the current program counter.
under program control. During SEQ or REQ instruction exe-
The selected register R(P) contains the address of the mem-
cution, Q is set or reset between the trailing edge of TPA and
ory location from which the instruction is to be fetched.
When the instruction is read out from the memory, the higherorder 4 bits of the instruction byte are loaded into the register
and the lower order 4 bits into the N register. The content ofthe program counter is automatically incremented by one so
Input for externally generated single-phase clock. The clock is
that R(P) is now “pointing” to the next byte in the memory.
counted down internally to 8 clock pulses per machine cycle.
The X designator selects one of the 16 registers R(X) to
“point” to the memory for an operand (or data) in certain ALU
Connection to be used with clock input terminal, for an exter-
nal crystal, if the on-chip oscillator is utilized. The crystal is
The N designator can perform the following five functions
connected between terminals 1 and 39 (CLOCK and XTAL)
depending on the type of instruction fetched:
in parallel with a resistance (10MΩ typ). Frequency trimmingcapacitors may be required at terminals 1 and 39. For addi-
1. Designate one of the 16 registers in R to be acted upon
tional information, see Application Note AN6565.
2. Indicate to the I/O devices a command code or device
WAIT, CLEAR (2 Control Lines)
Provide four control modes as listed in the following truth table:
3. Indicate the specific operation to be executed during the
ALU instructions, types of test to be performed during the
Branch instruction, or the specific operation required in a
class of miscellaneous instructions (70 - 73 and 78 - 7B).
4. Indicate the value to be loaded into P to designate a new
register to be used as the program counter R(P).
5. Indicate the value to be loaded into X to designate a new
register to be used as data pointer R(X). VDD, VSS, VCC (Power Levels)
The registers in R can be assigned by a programmer in three
different ways: as program counters, as data pointers, or as
scratchpad locations (data registers) to hold two bytes of data.
operate at maximum speed while interfacing with peripheral
Program Counters
devices operating at lower voltage. VCC must be less than orequal to VDD. All outputs swing from VSS to VCC. The recom-
Any register can be the main program counter; the address
mended input voltage swing is VSS to VCC.
of the selected register is held in the P designator. Other reg-
CDP1802A, CDP1802AC, CDP1802BC
isters in R can be used as subroutine program counters. By
Interrupt Servicing
single instruction the contents of the P register can be
Register R(1) is always used as the program counter when-
changed to effect a “call” to a subroutine. When interrupts
ever interrupt servicing is initiated. When an interrupt
are being serviced, register R(1) is used as the program
request occurs and the interrupt is allowed by the program
counter for the user's interrupt servicing routine. After reset,
(again, nothing takes place until the completion of the cur-
and during a DMA operation, R(0) is used as the program
rent instruction), the contents of the X and P registers are
counter. At all other times the register designated as pro-
stored in the temporary register T, and X and P are set to
gram counter is at the discretion of the user.
new values; hex digit 2 in X and hex digit 1 in P. Interrupt
Data Pointers
Enable is automatically deactivated to inhibit further inter-rupts. The user's interrupt routine is now in control; the con-
The registers in R may be used as data pointers to indicate a
tents of T may be saved by means of a single instruction (78)
location in memory. The register designated by X (i.e., R(X))
in the memory location pointed to by R(X). At the conclusion
points to memory for the following instructions (see Table 1).
of the interrupt, the user's routine may restore the pre-inter-
1. ALU operations F1 - F5, F7, 74, 75, 77
rupted value of X and P with a single instruction (70 or 71). The Interrupt Enable flip-flop can be activated to permit fur-
ther interrupts or can be disabled to prevent them. CPU Register Summary
4. Certain miscellaneous instructions - 70 - 73, 78, 60, F0
The register designated by N (i.e., R(N)) points to memory
for the “load D from memory” instructions 0N and 4N and the
“Store D” instruction 5N. The register designated by P (i.e.,the program counter) is used as the data pointer for ALU
instructions F8 - FD, FF, 7C, 7D, 7F. During these instruction
Designates which register is Program Counter
executions, the operation is referred to as “data immediate”.
Designates which register is Data Pointer
Another important use of R as a data pointer supports the
built-in Direct-Memory-Access (DMA) function. When a
DMA-ln or DMA-Out request is received, one machine cycle
Holds old X, P after Interrupt (X is high nibble)
is “stolen”. This operation occurs at the end of the executemachine cycle in the current instruction. Register R(0) is
always used as the data pointer during the DMA operation.
The data is read from (DMA-Out) or written into (DMA-ln) thememory location pointed to by the R(0) register. At the end
CDP1802 Control Modes
of the transfer, R(0) is incremented by one so that the pro-cessor is ready to act upon the next DMA byte transfer
The WAIT and CLEAR lines provide four control modes as
request. This feature in the 1800-series architecture saves a
substantial amount of logic when fast exchanges of blocks of
data are required, such as with magnetic discs or during
Data Registers
When registers in R are used to store bytes of data, four
instructions are provided which allow D to receive from orwrite into either the higher-order or lower-order byte portions
The function of the modes are defined as follows:
of the register designated by N. By this mechanism (together
with loading by data immediate) program pointer and datapointer designations are initialized. Also, this technique
Holds the CPU in the IDLE execution state and allows an I/O
allows scratchpad registers in R to be used to hold general
device to load the memory without the need for a “bootstrap”
data. By employing increment or decrement instructions,
loader. It modifies the IDLE condition so that DMA-lN opera-
such registers may be used as loop counters.
tion does not force execution of the next instruction. The Q Flip-Flop
An internal flip-flop, Q, can be set or reset by instruction and
Registers l, N, Q are reset, lE is set and 0’s (VSS) are placed
can be sensed by conditional branch instructions. The output
on the data bus. TPA and TPB are suppressed while reset is
of Q is also available as a microprocessor output.
held and the CPU is placed in S1. The first machine cycle aftertermination of reset is an initialization cycle which requires 9clock pulses. During this cycle the CPU remains in S1 and reg-ister X, P, and R(0) are reset. Interrupt and DMA servicing are
CDP1802A, CDP1802AC, CDP1802BC
suppressed during the initialization cycle. The next cycle is an
Run-Mode State Transitions
S0, S1, or an S2 but never an S3. With the use of a 71 instruc-
The CPU state transitions when in the RUN and RESET
tion followed by 00 at memory locations 0000 and 0001, this
modes are shown in Figure 25. Each machine cycle requires
feature may be used to reset IE, so as to preclude interrupts
the same period of time, 8 clock pulses, except the initializa-
until ready for them. Power-up reset can be realized by con-
tion cycle, which requires 9 clock pulses. The execution of
necting an RC network directly to the CLEAR pin, since it has a
an instruction requires either two or three machine cycles,
Schmitt triggered input, see Figure 24.
S0 followed by a single S1 cycle or two S1 cycles. S2 is the
response to a DMA request and S3 is the interrupt response. Table 2 shows the conditions on Data Bus and Memory
Address lines during all machine states. THE RC TIME CONSTANT SHOULD BE GREATER THAN THE OSCILLATOR START-UP Instruction Set TIME (TYPICALLY 20ms)
The CPU instruction summary is given in Table 1. Hexadeci-mal notation is used to refer to the 4-bit binary codes. FIGURE 24. RESET DIAGRAM
In all registers bits are numbered from the least significantbit (LSB) to the most significant bit (MSB) starting with 0.
Stops the internal CPU timing generator on the first negative
high-to-low transition of the input clock. The oscillator contin-ues to operate, but subsequent clock transitions are ignored.
May be initiated from the Pause or Reset mode functions. If
initiated from Pause, the CPU resumes operation on the first
negative high-to-low transition of the input clock. When initi-ated from the Reset operation, the first machine cycle follow-
This notation means: The memory byte pointed to by R(N) is
ing Reset is always the initialization cycle. The initialization
loaded into D, and R(N) is incremented by 1.
cycle is then followed by a DMA (S2) cycle or fetch (S0) fromlocation 0000 in memory. IDLE • DMA • INT (LONG BRANCH, LONG SKIP, NOP, ETC.) S1 EXECUTE INT • DMA DMA • IDLE • INT DMA • INT PRIORITY: FORCE S0, S1 INT • DMA DMA IN DMA OUT INT FIGURE 25. STATE TRANSITION DIAGRAM CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) INSTRUCTION MNEMONIC OPERATION MEMORY REFERENCE REGISTER OPERATIONS LOGIC OPERATIONS (Note 1)
SHIFT D RIGHT, LSB(D) → DF, 0 → MSB(D)
SHIFT D RIGHT, LSB(D) → DF, DF → MSB(D)
SHIFT D RIGHT, LSB(D) → DF, DF → MSB(D)
SHIFT D LEFT, MSB(D) → DF, 0 → LSB(D)
SHIFT D LEFT, MSB(D) → DF, DF → LSB(D)
SHIFT D LEFT, MSB(D) → DF, DF → LSB(D)
ARITHMETIC OPERATIONS (Note 1)
M(R(P)) + D + DF → DF, D; R(P) + 1 → R(P)
CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) INSTRUCTION MNEMONIC OPERATION
M(R(P)) - D - (Not DF) → DF, D; R(P) + 1 → R(P)
D-M(R(P))-(NOT DF) → DF, D; R(P) + 1 → R(P)
BRANCH INSTRUCTIONS - SHORT BRANCH
IF D = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF D NOT 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF DF = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF DF = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF Q = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF Q = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF1 =1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF1 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF2 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF2 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF3 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF3 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF4 = 1, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
IF EF4 = 0, M(R(P)) → R(P).0, ELSE R(P) + 1 → R(P)
BRANCH INSTRUCTIONS - LONG BRANCH
M(R(P)) → R(P). 1, M(R(P) + 1) → R(P).0
lF D = 0, M(R(P)) → R(P).1, M(R(P) +1) → R(P).0,ELSE R(P) + 2 → R(P)
IF D Not 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSE
lF DF = 1, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSER(P) + 2 → R(P)
IF DF = 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0, ELSER(P) + 2 → R(P)
IF Q = 1, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0,ELSE R(P) + 2 → R(P)
CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) INSTRUCTION MNEMONIC OPERATION
lF Q = 0, M(R(P)) → R(P).1, M(R(P) + 1) → R(P).0EISE R(P) + 2 → R(P)
SKIP INSTRUCTIONS
IF D = 0, R(P) + 2 → R(P), ELSE CONTINUE
IF D Not 0, R(P) + 2 → R(P), ELSE CONTINUE
IF DF = 1, R(P) + 2 → R(P), ELSE CONTINUE
IF DF = 0, R(P) + 2 → R(P), ELSE CONTINUE
IF Q = 1, R(P) + 2 → R(P), ELSE CONTINUE
IF Q = 0, R(P) + 2 → R(P), ELSE CONTINUE
IF IE = 1, R(P) + 2 → R(P), ELSE CONTINUE
CONTROL INSTRUCTIONS
WAIT FOR DMA OR INTERRUPT; M(R(0)) → BUS
(X, P) → T; (X, P) → M(R(2)), THEN P → X; R(2) - 1 → R(2)
M(R(X)) → (X, P); R(X) + 1 → R(X), 1 → lE
M(R(X)) → (X, P); R(X) + 1 → R(X), 0 → lE
INPUT - OUTPUT BYTE TRANSFER
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 1
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 2
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 3
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 4
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 5
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 6
M(R(X)) → BUS; R(X) + 1 → R(X); N LINES = 7
CDP1802A, CDP1802AC, CDP1802BC TABLE 1. INSTRUCTION SUMMARY (SEE NOTES) (Continued) INSTRUCTION MNEMONIC OPERATION
1. The arithmetic operations and the shift instructions are the only instructions that can alter the DF.
After an add instruction:DF = 1 denotes a carry has occurredDF = 0 Denotes a carry has not occurredAfter a subtract instruction:DF = 1 denotes no borrow. D is a true positive numberDF = 0 denotes a borrow. D is two’s complementThe syntax “-(not DF)” denotes the subtraction of the borrow.
2. This instruction is associated with more than one mnemonic. Each mnemonic is individually listed.
3. An idle instruction initiates a repeating S1 cycle. The processor will continue to idle until an I/O request (INTERRUPT, DMA-lN, or DMA- OUT) is
activated. When the request is acknowledged, the idle cycle is terminated and the I/O request is serviced, and then normal operation is resumed.
4. Long-Branch, Long-Skip and No Op instructions require three cycles to complete (1 fetch + 2 execute).
Long-Branch instructions are three bytes long. The first byte specifies the condition to be tested; and the second and third byte, thebranching address.
If the tested condition is met, then branching takes place; the branching address bytes are loaded in the high-and-low order bytes of thecurrent program counter, respectively. This operation effects a branch to any memory location.
If the tested condition is not met, the branching address bytes are skipped over, and the next instruction in sequence is fetched and exe-cuted. This operation is taken for the case of unconditional no branch (NLBR).
5. The short-branch instructions are two bytes long. The first byte specifies the condition to be tested, and the second specifies the branching address.
Test the status (1 or 0) of the four EF flags
If the tested condition is met, then branching takes place; the branching address byte is loaded into the low-order byte position of thecurrent program counter. This effects a branch within the current 256-byte page of the memory, i.e., the page which holds the branchingaddress. If the tested condition is not met, the branching address byte is skipped over, and the next instruction in sequence is fetchedand executed. This same action is taken in the case of unconditional no branch (NBR).
6. The skip instructions are one byte long. There is one Unconditional Short-Skip (SKP) and eight Long-Skip instructions.
The Unconditional Short-Skip instruction takes 2 cycles to complete (1 fetch + 1 execute). Its action is to skip over the byte following it. Then the next instruction in sequence is fetched and executed. This SKP instruction is identical to the unconditional no-branch instruc-tion (NBR) except that the skipped-over byte is not considered part of the program. The Long-Skip instructions take three cycles to complete (1 fetch + 2 execute).
If the tested condition is met, then Long Skip takes place; the current program counter is incremented twice. Thus two bytes are skippedover, and the next instruction in sequence is fetched and executed. If the tested condition is not met, then no action is taken. Executionis continued by fetching the next instruction in sequence. CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES OPERATION CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES (Continued) OPERATION CDP1802A, CDP1802AC, CDP1802BC TABLE 2. CONDITIONS ON DATA BUS AND MEMORY ADDRESS LINES DURING ALL MACHINE STATES (Continued) OPERATION
1. lE = 1, TPA, TPB suppressed, state = S1.
6. IN REQUEST has priority over OUT REQUEST.
7. See Timing Waveforms, Figure 5 through Figure 14 for machine cycles. Operating and Handling Considerations Handling Input Signals - To prevent damage to the input protection circuit, input signals should never be greater than V
All inputs and outputs of Intersil CMOS devices have a net-
work for electrostatic protection during handling.
SS. Input currents must not exceed 10mA even
Operating Unused Inputs - A connection must be provided at every Operating Voltage - During operation near the maximum
input terminal. All unused input terminals must be connected
supply voltage limit care should be taken to avoid or suppress
to either VDD or VSS, whichever is appropriate.
power supply turn-on and turn-off transients, power supply rip-
Output Short Circuits - Shorting of outputs to VDD or VSS
ple, or ground noise; any of these conditions must not cause
may damage CMOS devices by exceeding the maximum
VDD - VSS to exceed the absolute maximum rating.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time withoutnotice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurateand reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties whichmay result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
NOMEX® TIPO 414 NOMEX® tipo 414 está diseñado para aplica- Propiedades eléctricas ciones que requieren una placa resistenteLa Tabla I muestra los valores típicos de lasademás de flexible y conformable. Sus propie-propiedades eléctricas de NOMEX® tipo 414. CARACTERÍSTICAS dades eléctricas y térmicas son muy similares aLos valores de la Resistencia Dieléctrica conlas de N
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